Vancouver, Canada. 26 OCTOBER, 2021 – Turnium Technology Group, Inc. is pleased to announce an embedded multi-path site networking solution with Lanner Electronics at Mobile World Congress Los Angeles, October 26-28, 2021. The solution, to be demonstrated in Lanner’s booth (#1740), includes Turnium’s off-the-shelf network bonding and failover software pre-installed on Lanner’s uCPE L-1515 device. […]
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